2007-04-19 1 bas21... silicon switching diode ? for high-speed switching applications ? high breakdown voltage ? pb-free (rohs compliant) package 1) ? qualified according aec q101 bas21 BAS21-03W bas21u type package configuration marking bas21 BAS21-03W bas21u sot23 sod323 sc74 single single parallel triple jss d jss maximum ratings at t a = 25c, unless otherwise specified parameter symbol value unit diode reverse voltage v r 200 v peak reverse voltage v rm 250 forward current i f 250 ma peak forward current i fm 625 peak forward current i fm 625 ma surge forward current, t = 10 s i fs 4 a non-repetitive peak surge forward current i fsm - total power dissipation bas21, t s 70c BAS21-03W, t s 124c bas21u, t s 122c p tot 350 250 250 mw junction temperature t j 150 c storage temperature t stg -65 ... 150 1 pb-containing package may be available upon special request
2007-04-19 2 bas21... thermal resistance parameter symbol value unit junction - soldering point 1) bas21 BAS21-03W bas21u r thjs 230 105 110 k/w electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics breakdown voltage i (br) = 100 a v (br) 250 - - v reverse current v r = 200 v v r = 200 v, t a = 150 c i r - - - - 0.1 100 a forward voltage i f = 100 ma i f = 200 ma v f - - - - 1 1.25 v ac characteristics diode capacitance v r = 0 v, f = 1 mhz c t - - 5 pf reverse recovery time i f = 30 ma, i r = 30 ma, measured at i r = 3ma, r l = 100 ? t rr - - 50 ns test circuit for reverse recovery time ehn00018 oscillograph f d.u.t. puls generator: t p = 1s, d = 0.05 t r = 0.6ns, r i = 50 ? oscillograph: r = 50 ? , t r = 0.35ns, c 1pf 1 for calculation of r thja please refer to application note thermal resistance
2007-04-19 3 bas21... reverse current i r = ? ( t a ) v r = 200v 10 0 50 100 150 bas 19...21 ehb00027 t a r ?c 0 -2 5 5 5 max typ. a 10 -1 10 10 1 10 2 forward voltage v f = ? ( t a ) i f = parameter 0.0 0 bas 19...21 ehb00029 t a v f ?c 0.5 1.0 v 1.5 50 100 150 f = 625 ma ma 250 100 ma 10 ma forward current i f = ? ( v f ) 0.0 0 ehb00028 bas 19...21 v f f 100 200 300 400 500 600 700 ma 800 0.5 1.0 v 1.5 forward current i f = ? ( t s ) BAS21-03W 0 15 30 45 60 75 90 105 120 c 150 t s 0 50 100 150 200 ma 300 i f
2007-04-19 4 bas21... forward current i f = ? ( t s ) bas21u 0 15 30 45 60 75 90 105 120 c 150 t s 0 50 100 150 ma 250 i f permissible puls load r thjs = ? ( t p ) bas21 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 r thjs d = 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 permissible pulse load i fmax / i fdc = ? ( t p ) bas21 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 i fmax / i fdc d = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 permissible puls load r thjs = ? ( t p ) BAS21-03W 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs d=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0
2007-04-19 5 bas21... permissible pulse load i fmax / i fdc = ? ( t p ) BAS21-03W 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 i fmax / i fdc d=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 permissible pulse load i fmax / i fdc = ? ( t p ) bas21u 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 i fmax / i fdc d=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 permissible puls load r thjs = ? ( t p ) bas21u 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs d=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0
2007-04-19 6 bas21... package sc74 package outline foot print standard packing 0.5 0.95 1.9 2.9 54 6 3 2 1 1.1 max. (0.35) (2.25) 0.2 2.9 b 0.2 +0.1 -0.05 0.35 pin 1 marking m b 6x 0.95 1.9 0.15 -0.06 +0.1 1.6 10? max. a 0.1 2.5 0.25 10? max. 0.1 0.1 a 0.2 m 0.1 max. 2.7 4 3.15 pin 1 marking 8 0.2 1.15 reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel for symmetric types no defined pin 1 orientation in reel. manufacturer 2005, june date code (year/month) bcw66h type code pin 1 marking laser marking marking layout (example) small variations in positioning of date code, type code and manufacture are possible.
2007-04-19 7 bas21... package sod323 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel bar63-03w type code cathode marking laser marking 0.8 0.8 0.6 1.7 marking cathode 0.2 2.5 0.25 0.3 1 -0.05 m a +0.1 +0.2 2 1.25 -0.1 +0.05 -0.2 1.7 0.3 0.15 -0.06 +0.1 0 0.05 +0.2 -0.1 a 0.9 +0.2 -0.1 0.15 0.45 0.2 4 8 2.9 1 2 1.35 0.65 cathode marking
2007-04-19 8 bas21... package sot23 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel eh s bcw66 type code pin 1 0.8 0.9 0.9 1.3 0.8 1.2 0.25 m bc 1.9 -0.05 +0.1 0.4 0.1 2.9 0.95 c b 0...8? 0.2 a 0.1 max. 10? max. 0.08...0.15 1.3 0.1 10? max. m 2.4 0.15 0.1 1 a 0.15 min. 1) 1) lead width can be 0.6 max. in dambar area 12 3 3.15 4 2.65 2.13 0.9 8 0.2 1.15 pin 1 manufacturer 2005, june date code (ym)
2007-04-19 9 bas21... edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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